Ultra-fine diameter superhard discharge machining electrode for semiconductor molds
Tungsten carbide electrode with a minimum diameter of φ0.01. For precision drilling of fine holes in mold processing.
In the semiconductor industry, high-precision micro-machining is required for mold processing. In particular, for molds that are essential for semiconductor manufacturing, the ability to process fine holes with high precision significantly affects product quality and yield. Conventional electrodes have limitations in terms of thinness and durability, leading to challenges in machining accuracy and efficiency. Sanwa Creation's ultra-small diameter carbide discharge machining electrodes address these issues. 【Application Scenarios】 - Micro hole processing for semiconductor molds - Electrical discharge machining of precision parts - Mold processing requiring high-precision drilling 【Benefits of Implementation】 - Achievement of high-precision micro hole processing - Improvement of mold lifespan - Reduction of processing time - Increase in yield
- Company:SANWA CREATION Co.,Ltd.
- Price:Other